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Custom Hybrids

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Custom Hybrids

For more than 50 years, DDC has been a trusted manufacturer of highly reliable hybrid microelectronic solutions, supporting the critical, long life cycle requirements of military, industrial and space applications worldwide. DDC’s experience and expertise includes the design and manufacture of all types of hybrid microelectronics, including analog, digital, mixed signal, power, radiation tolerant/space grade, and high temperature.

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Applications

Core Expertise

  • Analog
  • Digital
  • Mixed Signal
  • Power
  • Processors, Microcontrollers, FPGAs
  • Memory Modules
  • Radiation Tolerant/Space Grade, including RAD-PAK® shielding
  • High Temperature
  • Chip on Board
  • Embedded Transformers & Inductors
  • Stacked Die MCMs

Technical Services

  • Electrical Design Engineering
  • Software Engineering
  • Mechanical Engineering
  • Process Engineering
  • Radiation Effects Engineering
  • Program Management
  • Design Validation & Verification
  • Test & Evaluation
  • Component Engineering
  • Design for Manufacturing
  • Life Cycle Management
  • DLA Compliant Designs (DO-254/178)

Packaging

  • Hermetic
  • Power Hybrids
  • Metal
  • Ceramic including Co-Fired
  • Chip-On-Board
  • RAD-PAK®
    • High Radiation Protection (TID 100 krad)
  • Plastic BGA (Ball Grid Array)
  • MLCC (Micro Lead Frame Chip Carrier)
  • PLCC (Plastic Leaded Chip Carrier)
  • QFP (Quad Flat Pack)
  • QFN (Quad Flat No-Lead Package)
  • 3D Packaging
  • Mixed Technology
  • SMT/COB

Manufacturing

  • Near Void Free Die Attach
  • Flip-Chip Capability
  • Multilayer Silk Screen
  • Automated Wire & Die bonding
  • Lid seal & Environmental Conditioning
  • High Definition Leak Detection
  • Automated In-House Electrical Test & Environmental Screening
  • Secure Programs
  • TOR Compliant
  • Active Trimming
  • In-House Magnetics