Products

Data Bus

Motion Control

Beta Transformer

Rad-Tolerant Solutions

Custom Solutions

Applications

Discontinued/Obsolete

Custom Hybrids & ASICs
Custom Hybrid


Data Device Corporation, a world leader in the design and manufacture of high-reliability Connectivity, Power and Control solutions, has been producing custom hybrid and ASIC solutions for use in military, commercial aerospace, space, and industrial applications, for more than 40 years.

DDC’s core competencies and unique suite of capabilities for the production of hybrid and ASIC solutions span every stage of development including electrical design, mechanical design, test engineering, process engineering, manufacturing, and product assurance. DDC is uniquely qualified to support a wide range of application requirements and technologies based upon our decades of experience in analog and digital microelectronics, magnetics, power supplies, radiation mitigation technology and top quality certifications for AS9100 Rev C, ISO 9001:2008, EN9100, JIS Q9100 and through the DLA MIL-PRF-38534.

For space and extreme environmental conditions, DDC’s microcircuit experience includes the design and manufacturing of power hybrids, hybrids for space applications, and hybrids designed for high temperature (200°C+) environments such as down-hole oil and gas exploration.

Our comprehensive range of capabilities enables DDC to deliver optimized custom hybrid and ASIC solutions to support all application requirements, including build-to-spec, build-to-schematic, and build-to-print. Additionally, DDC has the capacity to support high volume packaging and testing through partnerships with industry leading semiconductor foundries and suppliers.

Hybrid Capabilities
Total Space
Application Capabilities
  • Motor Controllers/Drives
  • Power Distribution / Protection / SSPCs
  • Power Supplies/DC-to-DC Converters
  • Data Buses/Networking (MIL-STD-1553, ARINC 429, Fibre Channel, Ethernet, CANbus, Others)
  • Motion Feedback/Conversion (Synchro/Resolver/LVDT)
  • Transformers & Inductors
Packaging
  • Metal
  • Ceramic
  • Co-Fired Ceramic
  • Chip-On-Board
  • Plastic BGA
  • BGA (Ball Grid Array)
  • MLCC (Micro Lead Frame Chip Carrier)
  • PLCC (Plastic Leaded Chip Carrier)
  • QFP (Quad Flat Pack)
  • QFN (Quad Flat No-Lead Package)
Hybrid Manufacturing
  • Multilayer Silk Screen
  • Automated Wire & Die bonding
  • Lid seal & Environmental Conditioning
  • In-House Final Test & Environmental Screening
  • Flip-Chip Capability
  • Stacked Die
Core Expertise
  • Analog
  • Digital
  • Mixed Signal
  • Power
  • Processors, Microcontrollers, FPGAs
  • Radiation Tolerant/Space Grade, including RAD-PAK® shielding
  • High Temperature
  • MCM
Engineering
  • Design Engineering
  • Mechanical Engineering
  • Process Engineering
  • Design Validation & Verification
  • Test & Evaluation
  • Thermal Management
Certifications & Qualifications
  • ISO-9001:2008
  • AS9100 Rev. C
  • EN9100 Compliant
  • JIS Q9100 Compliant
  • MIL-PRF-38534; Class D, G, H, and K Qualified
  • Capability to Design to DO-254, DO-178, and DO-160
DDC's DLA Certified MIL-PRF-38534 (MIL-STD-883) Test Methods
  • Insulation Resistance (TM1003)
  • Moisture Resistance (TM1004)
  • Life Test (TM1005)
  • Stabilization Bake (TM1008)
  • Salt Atmosphere (TM1009)
  • Temperature Cycling (TM1010)
  • Thermal Shock (TM1011)
  • Seal (TM1014)
  • Burn-In (TM1015)
  • Constant Acceleration (TM2001)
  • Solderability (TM2003)
  • Lead Integrity (TM2004)
  • External Visual (TM2009)
  • Internal Visual
  • Monolithic (TM2010)
  • Hybrid (TM2017)
  • Passive (TM2032)
  • Transistors (TM2072)
  • Diodes (TM2073)
  • Bond Strength (TM2011)
  • Internal Visual & Mechanical (TM2014)
  • Resistance to Solvents (TM2015)
  • Physical Dimensions (TM2016)
  • Die Shear (TM2019)
  • PIND (TM2020)
  • Non-Destruct Bond Pull (TM2023)
View MIL-STD-883 Test Methods referenced above:
(DLA Land & Maritime – Test Method Standard, Microcircuits)
ASICs Capabilities
hybrid capabilities
Unique Capabilities
  • Dedicated ASIC Design Team
  • Experience in High Voltage Processes
  • DO-254 and DO-178 Compliant
  • Radiation Hard ASICs with High TID and SEE/SEU Immunity
  • Experience in a wide range of processes including:
  • CMOS (down to 90nm)
  • BiCMOS
  • BCDMOS
  • HVIC
Core Expertise
  • Analog
  • Digital
  • Mixed Signal
  • Power
  • Radiation Tolerant/Space Grade
  • RF
  • Hybrid/MCM Packaging
Design Complexity Experience
  • High transistor counts – up to 60,000
  • High logic gate counts – up to 50,000
  • High precision – 16-bit resolver-to-digital converters, with accuracies down to ±1 minute
Building Blocks
  • Linear Amplifiers
  • OTAs
  • Voltage References
  • A/D and D/A Converters
  • Oscillators
  • Power Electronics
ASICs for DDC Standard Products
  • MIL-STD-1553
  • ARINC 429
  • Synchro/Resolver

For more than 40 years, DDC has been a trusted manufacturer of highly reliable hybrid microelectronic solutions, supporting the critical, long life cycle requirements of military, industrial and space applications worldwide. DDC’s experience and expertise includes the design and manufacture of all types of hybrid microelectronics, including analog, digital, mixed signal, power, radiation tolerant/space grade, and high temperature. Our designs are built upon DDC’s extensive process engineering capabilities in hybrid construction and screening, including metal, ceramic, and plastic packages; thick film, thin film, and beryllium substrates; all types of conductors and dielectrics; chip-and-wire, flip chip, and stacked die construction; and a myriad of capabilities in die bonding, wire bonding, lid sealing, and automated test. Additionally, DDC has the capacity to support high volume packaging and testing through partnerships with industry leading semiconductor foundries and suppliers.

Types of Hybrids
hybrid types
DDC Hybrid Assembly & Processing
  • Current Annual Volumes > 120,000 Hybrid/MCMs Devices
  • Die Bond Counts From 1 to 90
  • Current Die Bond Capacity: > 150,000 Bonds/Month --- 1,800,000 Bonds/Year
Die Bonding
  • Conductive and Non-Conductive Epoxy
  • Eutectic Bonding
Wire Bonding
Wire Bonding
  • Thermosonic ball bonding 1 or 2 mil gold wire for signals
  • Ultrasonic bonding for 1.25-20 mil aluminum wires for high current
Flip-Chip Capability
datacon diebond
  • Die handling from 0.17 mm to 50 mm, handles 300mm wafer magazines
  • Placement accuracy of ±10 µm @ 3s
  • Uptime of better than 98 percent
Die Handling
  • Established supply chain relationships with franchised distributors for procurement of die components
  • Currently utilizing Micross, Semi Dice and ES Components
  • Follows DDC’s standard purchasing operating procedures
  • Established material handling process for storage of die components
  • Raw material storage room contains nitrogen dry box chambers in 100K clean room
Vacuum Sealing / Solder Reflow Furnace
Automated Test
  • For near void free die attachment of high power dissipating devices (e.g., MOSFETs)
  • Uses positive pressure and vacuum for die attach at temperatures up to 1000° C
  • Hydrogen furnace
  • Pressure furnace forces die down on solder
  • Vacuum to draw out voids
  • Solders:
  • Sintered silver
  • Gold tin
Deposition
Deposition Screen Printing
  • Hybrid Substrate Fabrication
  • Multi-layer Silk-Screening
  • Conductive and Non-conductive Materials
  • Gold, Ceramic, Resistive Ink
Curing/Drying
Deposition Conveyor Furnace
  • In-house Conveyor Furnace
  • Temperatures up to +925° C
  • Substrate Built-up Layer upon Layer
  • Interconnections Between Layers
Trim
Laser Trim
  • Trim resistor values for thick film and thin film substrates
  • Laser burns portions of resistors to increase resistance value
  • Passive trim for high accuracy resistor tolerance
  • Active trim for high accuracy voltage or current tolerance
Conductors
  • Conductor Materials
  • Gold
  • Platinum Gold
  • Palladium Gold
  • Platinum Palladium Gold
  • Silver
  • Platinum Silver
  • Palladium Silver
  • Conductor Types
  • 5 mil Standard
  • Eutectic Attach
  • Solderable
  • Wire Bondable
Automated Test
  • Fully Automated Testing
  • Test Engineers Involved with all Phases of Product Development
  • VXI Test Standards
  • Power Supplies, Voltmeters, Digitizing Oscilloscopes, Load Banks, etc.
  • Hybrid-Specific Interface Test Adaptors (ITAs)
  • PC Based Test Software


Design Tools

Computer Aided Design (CAD)
hybrid capabilities
Thermal Models
hybrid capabilities

Other Designs Tools DDC Utilities:

  • Mozaix - Schematic Capture
  • Pantheon - PC Board Layout
  • Specctra - PC Board AutoRouting
  • Algor - Three-dimensional Conduction - cooled thermal analysis
  • CFDesign - Air-cooled thermal analysis
  • AutoCAD - Two-dimensional drawings
  • SolidWorks - Three-dimensional mechanical drawings
RAD-PAK® Radiation Shielding
Total AceXtreme Open
Total AceXtreme Open
  • High radiation protection (TID 100 krad for typical missions)
  • RAD-PAK® reduces the number of electrons and protons inside the package (e.g., less total dose on the die)
  • Up to 500x improvement for GEO missions
  • Up to 10x improvement for LEO missions


DDC’s engineering staff includes a team of dedicated ASIC design and test engineers that bring decades of experience, along with design tools and test capabilities to produce analog, digital, mixed signal, and RF ASICs. As the worldwide leader in MIL-STD-1553 data bus, synchro/resolver conversion, and highly reliable solid state power controllers, DDC is uniquely positioned to leverage our in-house experience and expertise to create low-risk, high Technology Readiness Level (TRL) custom ASIC solutions. In addition to our custom ASIC capabilities, DDC designs the ASICs utilized in our standard products, including MIL-STD-1553 transceivers and protocol, resolver-to-digital conversion, and ARINC 429 line drivers and receivers.

DDC’s ASIC engineers are experts in many types of common ASIC building blocks, including linear operational amplifiers, power amplifiers, bandgap references, OTAs, voltage references, various A/D and D/A converter designs, and power electronics including switching regulators, motor controllers and power FETs and diodes. We maintain a transistor-level design library using Cadence design tools to accelerate development. Additionally our ASIC design team has expertise with high-voltage processes and the design of radiation tolerant, latchup-free ASICs with high total dose (100 krads and higher) and SEE/SEU immunity. For safety-critical applications, we also offer the capability for developing DO-254 compliant designs. Additionally, DDC has the capacity to support high volume packaging and testing through partnerships with industry leading semiconductor foundries and suppliers.

ASICs Capabilities
hybrid capabilities
Unique Capabilities
  • Dedicated ASIC Design Team
  • Experience in High Voltage Processes
  • DO-254 and DO-178 Compliant
  • Radiation Hard ASICs with High TID and SEE/SEU Immunity
  • Experience in a wide range of processes including:
  • CMOS (down to 90nm)
  • BiCMOS
  • BCDMOS
  • HVIC
Core Expertise
  • Analog
  • Digital
  • Mixed Signal
  • Power
  • Radiation Tolerant/Space Grade
  • RF
  • Hybrid/MCM Packaging
Design Complexity Experience
  • High transistor counts – up to 60,000
  • High logic gate counts – up to 50,000
  • High precision – 16-bit resolver-to-digital converters, with accuracies down to ±1 minute
Building Blocks
  • Linear Amplifiers
  • OTAs
  • Voltage References
  • A/D and D/A Converters
  • Oscillators
  • Power Electronics
ASICs for DDC Standard Products
  • MIL-STD-1553
  • ARINC 429
  • Synchro/Resolver


DDC has more than 30 years of experience in the design and manufacture of hybrids for space applications. This includes supplying MIL-STD-1553, motion feedback, and motor drive and controller hybrids for use on launch vehicles, satellites, deep space applications, and the International Space Station. In satisfying customers’ needs to achieve the highest levels of reliability. DDC is fully qualified to build, test and qualify our hybrid circuits in accordance with MIL-PRF-38534 for all classes including class K.

DDC can also screen to specific profiles, enabling customers to choose from a menu including element evaluation, particle impact noise detection (PIND) testing, 320 hour burn-in, 100% nondestructive wire bond pull, and/or radiographic (X-ray) analysis. Additionally, DDC Microelectronics, formerly Maxwell Technologies, offers radiation mitigation RAD-PAK® Technology. RAD-PAK® enables DDC to deliver reduced cost space grade solutions providing total dose immunity of 100 krads or higher utilizing standard commercial chips. RAD-PAK-based solutions have been qualified for use by NASA.

Space Level Capabilities
space walk
hybrid capabilities

Materials and Components – Element Evaluation

  • Active Elements (every wafer lot)
  • 100% high magnification visual
  • 100% probe at room temperature
  • Samples assembled and put through standard environmental screening, including burn-in and electrical at min, max, and room temperature
  • Life Test
  • Scanning electron microscope (SEM)
  • Wire bond pull
  • Passive Elements (capacitors, resistors, inductors - per component manufacturing lot)
  • 100% visual
  • 100% electrical on select parameters at room temperature
  • Sample assembled and screened, including voltage conditioning and full electrical at room temperature
  • Wire bond pull
  • Hybrid Microcircuit 100% Testing
  • Non-destructive bond pull
  • Internal visual inspection
  • Temperature cycling 10 times from -65°C to +150°C
  • Constant acceleration 3,000 G
  • PIND 1% PDA on 5th run and under 25% total
  • Burn-in 320 hours at +125°C, PDA 2% second half of burn in/ Burn-in 160 hours at +125°C, PDA 10%
  • Seal (fine and gross)
  • Full electrical test at min, max, and room temperature
  • Radiography
  • External visual
  • Material Control
  • Full lot traceability to individual wafer
  • Lot homogeneity

RAD-PAK® Radiation Shielding
Total AceXtreme Open
Total AceXtreme Open
  • High radiation protection (TID 100 krad for typical missions)
  • RAD-PAK® reduces the number of electrons and protons inside the package (e.g., less total dose on the die)
  • Up to 500x improvement for GEO missions
  • Up to 10x improvement for LEO missions

Space Platforms with DDC Technology
Rocket Icon


Satellite Icon
  • Advanced EHF Military Communications Satellite
  • Ariane 5 Rocket
  • Chandrayaan-1 Unmanned Lunar Probe
  • DORIS
  • ExoMars Trace Gas Orbiter
  • Hubble Rescue Vehicle
  • International Space Station
  • Jason 3
  • JWST
  • MEASAT
  • NPOESS
  • OCO
  • SBIRS Geo-1 Satellite
  • Spacebus 4000
  • Mars Science Lab Curiosity
Space Station


Moon Buggy

DDC’s Product Assurance team is dedicated to employing and maintaining a strong quality system in compliance with MIL-PRF-38534, AS9100, ISO 9001:2008, and to support the long life cycle requirements of aerospace and defense programs.

DDC has been granted certification by the Defense Logistics Agency, Land & Maritime (DLA) for manufacturing Class K, H, G and D hybrid products in accordance with MIL-PRF-38534. The Quality System, as outlined in DDC’s Product Assurance Manual, assures product conformance to specified requirements through controlled processes and Quality Assurance planning. The Management Review process evaluates quality indicators to ensure that the Quality System continues to be suitable and effective.

Certifications & Qualifications
  • ISO-9001:2008
  • AS9100 Rev. C
  • EN9100 Compliant
  • JIS Q9100 Compliant
  • MIL-PRF-38534; Class D, G, H, and K Qualified
  • Capability to Design to DO-254, DO-178, and DO-160
Life Cycle Management
  • Vendor Life Cycle Checks
  • Life Time Buy
  • Customer Notification prior to Obsolescence (goal is 2 years)
  • Configuration Management
  • Class 1 for Standard Product
  • Class 2 Notification Available
  • Generation-to-Generation Compatibility
  • Use of In-House Intellectual Property
  • Boeing Approval to D6-82479

Quality Assurance
quality assurance
Test & Evaluation
test and evaluation
Temperature Cycling
Temperature Cycling
Burn-In
Burn In
X-Ray Inspection
X-Ray Inspection

Industry Recognition
ddc awards
  • Raytheon:
  • 3 Star Supplier Excellence: 2012, 2011, 2010, 2009, 2008, 2007
  • 2007 Network Centric Systems 3 Star Supplier Excellence Award
  • 2006 IDS Supplier Excellence Award
  • 2005 Supplier Excellence Award
  • Lockheed Martin:
  • 2010 Platinum Level Preferred Supplier Award
  • 2006 STAR Supplier Award
  • 2004 Preferred Supplier Program Gold Supplier Award
  • L-3 Communication Systems-West:
  • 2011 Platinum Award for Exceptional Supplier Quality and Delivery Performance
  • General Atomics:
  • 2012 Supplier Excellence Award
  • 2010 Supplier Excellence Award
  • Other Awards
  • Honeywell Sensor and Guidance Supplier Excellence Award
  • CASS CSP Support Symposium Award for Outstanding Supplier Performance
  • LIFT Award "Long Island Forum for Technology"
Solutions for Extreme Environments

Extreme environments demand technology that is engineered to survive in the most extreme conditions, including temperatures to +200°C and beyond, intense shock and vibration. DDC’s innovative technology outperforms traditional silicon solutions with an elevated level of performance for high-reliability and radiation tolerant applications. Our product solutions provide:

Rugged Solutions for Intense Temperature, Humidity, Shock and Vibration Environments
  • Metal Hybrids
  • Ceramic Hybrid

High Temperature Range: to +200°C
  • Silicon On Insulator (SOI) Semiconductor Solutions for Higher Temperature Support
  • High Temperature Die Attach and Mono-metallic Wire Bonding Methodologies

High Temperature Application Examples:
Aerospace
Engine Control
Engine Control
Defense
Missile Fin Actuation
Missle Fin Actuation
Oil & Gas
Drilling & Logging
Drilling and Logging

Customer Information
First Name: Last Name:
Job Title:
Company:
Address 1:
Address 2:
City: State:
Zip/Postal Code: Country:
Phone: Email:
Custom Design
Start of Production Date:  
Total Production Quantity:
Tell us what you need...
(check all that apply)
Hybrid Packaging
Metal
Ceramic
Plastic
Chip-on-Board
Other:

ASIC
Analog
Digital
Mixed Signal
Other:

Environmentals
Space/Radiation Tolerant
Hi-Temperature
RoHS
Class H
Class K
Other:

Design Certifications
DO-254
DO-160
DO-178
Other:

Additional Comments: