A - Plastic Components:The Lead-free option for these products is available with a Matte Tin finish. DDC can provide the reliability and tin whisker growth data associated with these products; however, tin whisker growth is dependent on the application environment and customers should collect their own reliability data and perform a risk assessment based on their individual requirements.
B - Printed Circuit Board base products (i.e. PCB's and Modules):These products contain tin-lead solder.
C - Hybrid products:These products contain tin-lead solder finish as applicable to solder dip requirements.
D - BGA products:These products contain tin-lead solder, however, some products may offer lead free versions. Check ordering information for availability.