A - Plastic Resolver-to-Digital components: The Lead-free option for these products is available with a Matte Tin finish. DDC can provide the reliability and tin whisker growth data associated with these products; however, tin whisker growth is dependent on the application environment and customers should collect their own reliability data and perform a risk assessment based on their individual requirements.
B - Printed Circuit Board base products (i.e. PCB's and Modules): These products contain tin-lead solder.
C - Hybrid products: These products contain tin-lead solder finish as applicable to solder dip requirements.
D - BGA products: These products contain tin-lead solder.